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Basic research on electronic component-production of the future
The Department for Integrated Sensor Systems at Danube University Krems has set its research focus on new measuring methods in the micro and nano range, which shall be implemented in the production of highly integrated electronic components.
25.02.2019
The latest mobile phones 5G generation shall also benefit from the following research cooperation: the Chinese Academy of Sciences and an Austrian specialist for atomic force and scanning electron microscopy are expected to carry out basic research in the production of new, miniaturized components. Miniaturization alters the physical properties of the thin films in the components. The Department of Integrated Sensor Systems is developing new methods to detect these deviations and thus ensure production quality.

 

Semiconductors play a particularly important role in electronics. To maintain their crystalline structure during miniaturization is jet not easy. In order to produce electronic components, semiconductor layers are applied and structured on silicon base plates, so-called wafers. To produce smaller parts the semiconductor layers must be thinner, and important characteristics vary such as piezoelectric coefficients or thermal properties. In piezoelectricity, deformation of the solid results in a voltage and vice versa. Thermal properties include thermal conductivity and thermal capacity. The aim is to preserve the outstanding physical properties of the thicker, monocrystalline layers in the nanometer range.


Basic research in micro measurement methods

As the application of extremely thin semiconductor layers is a complex process the Chinese Academy of Science is researching with a new method. The layer still blisters or peels off after it was deposited in the course of this new process, known as "ion-assisted heterointegration". Up to date, no precise measurement method to enable a rapid and non-destructive measurement directly on the wafer exists for such structures. This is where the basic research of the Department of Integrated Sensor Systems at Danube University Krems comes into the "H-iSlice" project and studies the integration of lithium niobate (LNO) nanofilms on silicon wafers. Furthermore the influence of various parameters in the production process on the reliability, stability and reproducibility of these LNO nanofilms as well as the material parameters are comprehensively explored. Here the Austrian company GETec Microscopy’s knowledge about investigating material parameters comes into play, and extends the range of electron microscopes adding possibilities of atomic force microscopy.


Within the framework the project is supported on the basis of the bilateral cooperation agreement between Austria and the Chinese Academy of Sciences (CAS).


Title: Next generation heterointegration of ion sliced lithium niobate nanofilms enabled by novel characterization tools
Project lead: a.o.Univ.-Prof. DI Dr. Thilo Sauter
Department: Department for Integrated Sensor Systems
Duration: 1 January 2019 to 31 December 2020
Contracting Authority: The Austria Research Promotion Agency (FFG), Federal Ministry for Transport, Innovation and Technology
Funding: The Austria Research Promotion Agency (FFG),
Project partners: GETec Microscopy GmbH, Chinese Academy of Sciences (CAS)


Further information:

 

Department for Integrated Sensor Systems
Project site (German)
Production of XOI wafers with long-term stability Atomic force microsopy - tip Measurement of lithium niobate
Photo: Danube University Krems ZOOM
Photo: Danube University Krems ZOOM
Photo: Danube University Krems ZOOM

Queries

Ao.-Prof. DI Dr. Thilo Sauter

Phone: +43 (0)2622 23420 - 11
Fax: +43 (0)2622 23420 - 99
E-Mail: thilo.sauter@donau-uni.ac.at
Website: http://www.donau-uni.ac.at/ciss
Address:
Donau-Universität Krems
Department für Integrierte Sensorsysteme
Viktor Kaplan Str. 2 E
2700 Wiener Neustadt, Austria