PCB integrated flow sensor development

Description

A novel approach to flow sensors for the application in HVAC plants (heating ventilating air conditioning) will be developed. The proposed measurement method for fluid flows is based on a combination of calorimetric and anemometric conversion. Advanced printed circuit board (PCB) technology is envisioned for transducer construction. Heating resistors and separated thermistors are implemented as copper traces on the PCB carrier. The low temperature coefficient of resistivity offered by copper causes a low transduction efficiency of the flow transduction. This disadvantage must be compensated by a sophisticated electronic controller. FEM simulations of the thermal system have been performed. First transducer types will be available in near future. * This project is co-funded by the FFG withing the Bridg 1 programme.

Details

Duration 01/03/2012 - 30/06/2015
Funding FFG
Program bridge
Department

Department for Integrated Sensor Systems

Center for Micro and Nano Sensors

Principle investigator for the project (Danube University Krems) habil. Dipl.-Ing. Dr. Thilo Sauter
Project members Dr. Thomas Glatzl, MSc

Publications

Lectures

PCB Thermal Flow Sensor for Heating, Ventilating, and Air Cooling Systems (Lehrveranstaltung)

Rigorosum, 24/10/2017

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