Within the project consortium, a novel tool for correlated in vivo, high-speed nanoinspection of semiconductor wafers up to 300 mm in size is developed. A wide range of surface analysis methods are combined and their results correlated, resulting in a comprehensive quality assurance and process control tool for micro- and nanotechnology manufacturing facilities.
In contrast to classical, well established AFM (Atomic Force Microcopy) methods, the CAS-C platform allows for surface analysis and material characterization of thin films or components to be performed very quickly and efficiently over wide areas directly on the wafer. While the achievable maximum resolution is lower than AFM, the scan areas and attainable scan speeds are significantly higher, allowing results to be obtained much faster and thus making it an ideal tool for large area inline nanoinspection of critical process steps in the semiconductor and chip industry. The CAS-C platform is ideally suited to drive the worldwide trend in the semiconductor industry for fast, uncomplicated (in terms of handling and evaluation) inline analysis at the nanoscale.
The Department of Integrated Sensor Systems is responsible for the overall system architecture and the integration of the different sensor modules. Our work focuses on design of electronic components, software development for correlation of different measurement techniques (topography, hardness, electrical and magnetic properties, ...) as well as development of the basic unit for high precision surface analysis.
** This project is co-funded by the FFG under the Eurostars-3 CoD 1 program and managed under project number FO999892361.