Department für Integrierte Sensorsysteme

The Department runs comprehensively equipped laboratories and modern (partly proprietary) modelling software to develop, test and characterize sensor/actuator systems, embedded systems and network systems:

  • High-end measurement equipment for characterization of embedded systems like spectrum analyzer (13,6 GHz), network analyzer, multi-channel oscilloscopes (up to 20 GS/s), communication network analysis, test networks incl. a dedicated timing infrastructure
  • Digital holographic MEMS analyzer (R-2100 from Lyncee Tec) for the characterization of oscillating MEMS structures: topography of the oscillating surface (resolution of 1 nm in-plane and 5 pm out-of-plane, frequency range from static to 25 MHz)
  • Test equipment for magnetic and magnetoresistive films and sensors: magnetoresistance and magnetization by Alternating Gradient Magnetometer (AGM) and Magneto-Optical Kerr Effect (MOKE) in linear and rotating fields up to 0,5 Tesla. Magnetoresistance in the temperature range of 20 K to 450 K (cryostat)
  • Noise measurement of sensors and electronic components: electrical and magnetic noise in the temperature range of 20 K to 450 K (cryostat)
  • Magnetometer (Vibrating Sample Magnetometer VSM 8604 from LakeShore) for the measurement of the magnetic moment, hysteresis and magnetic anisotropies in dependence of the temperature (up to 1000 °C) and the rotation angle in magnetic fields up to 2,5 Tesla
  • Software packages for the simulation and modelling of sensors and materials: Multiphysics and system simulation of thermal, thermomechanical, fluidic and electromagnetic problems (COMSOL, ANSYS HFSS, …), micromagnetic modelling (OOMMF, FEM) and simulation of optical properties of nano-objects (Discrete Dipole Approximation) as well as network and timing simulations (OMNeT++, ns-3)
  • Development of analytical models and model-based, highly efficient algorithms for control- and measurement tasks
  • CAD/CAE software for the design of electronic systems, circuit boards, FPGAs and ASICS (Altera, Xilinx, Mentor)
  • Fabrication of demonstrators, prototypes and small series of developed sensors / actuators: special equipment of a repair soldering station and micro milling cutter
  • Climate chamber for the characterization of electronic devices and sensors in the temperature range of -40 °C bis 180 °C. Maximum size of objects: 62 x 36 x 89 cm
  • For the technological fabrication of micro- and nano-structures, the Department has several strategic partnerships which allow for the access to the necessary fabrication technologies and cleanroom infrastructure (class 100 – 10000).
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