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Zhao, P.; Gusenbauer, M.; Oezelt, H.; Wolf, D.; Gemming, T.; Schrefl, T.; Nielsch, K.; Woodcock, T. G. (2023). Nanoscale chemical segregation to twin interfaces in t -MnAl-C and resulting effects on the magnetic properties. Journal of Materials Science & Technology, Vol. 134: 22-32

Kovacs, A.; Fischbacher, J.; Oezelt, H.; Kornell, A.; Ali, Q.; Gusenbauer, M.; Yano, M.; Sakuma, N.; Kinoshita, A.; Shoji, T.; Kato, A.; Hong, Y.; Grenier, S.; Devillers, T.; Dempsey, N. M.; Fukushima, T.; Akai, H.; Kawashima, N.; Miyake, T.; Schrefl, T. (2023). Physics-Informed Machine Learning Combining Experiment and Simulation for the Design of Neodymium-Iron-Boron Permanent Magnets with Reduced Critical-Elements Content. Frontiers in Materials 2023, Vol. 9: 1-19

Jakoby, B.; Beigelbeck, R.;Voglhuber-Brunnmaier, T. (2023). Understanding the Shielding Efficiency of a Faraday Grid Cage. IEEE Antennas and Propagation Magazine, Vol. 1: 2-11

Kurz, S.; Gringinger, E.; Rihacek, C.; Sauter, T. (2022). High Performance Implementation of Next Generation Aeronautical Communication Systems. IEEE Open Journal of the Industrial Electronics Society, Vol. 3: 700-710

Beigelbeck, R.; Keplinger, F. (2022). Design und feldtheoretische Analyse einer Hochfeldspule. e & i Elektrotechnik und Informationstechnik, Vol. 139: 494-503

Sisini, E.; Sauter, T.; Pang, Z.; Bernhard, H.-P. (2022). Guest Editorial: Advanced Industrial Communication Systems: A Sneak Peak to the Ecosystem of Next Generation Industrial Communications. IEEE Transactions on Industrial Informatics, Vol. 18, Iss. 10: 7316-7320

Chakkarapani, L. D.; Brand, M. (2022). Poly(methylene blue)-Film-Coated Carbon and MWCNT Screen-Printed Electrodes for Tyramine Detection †. MDPI, Vol. 21, Iss. 1: 57

Beigelbeck, R.; Jakoby, B. (2022). Sonderteil zu Ehren von Fritz Paschke. e & i Elektrotechnik und Informationstechnik, Vol. 139: 469-470

Shi, Y.; Karnouskos; S.; Sauter, T.; Fang, H. (2022). Guest Editorial: New Advancements in Industrial Cyber-Physical Systems. IEEE Transactions on Industrial Informatics, Vol. 19, Iss. 1: 712-715

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